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Table of Contents
Acknowledgments
Foreword
Table of Contents
List of Tables
List of Figures
Chapter One: Overview of the Electronics Industry
1.1 A Snapshot of Electronics Manufacturing
1.2 A Brief History of Electronics
1.3 Development of the Integrated Circuit
1.4 Thriving with Technology: An Example of Motorola
1.5 Trends in the Electronics Manufacturing Industry
1.5.1 The Big Picture
1.6 Components
1.7 Outsourcing
Chapter Two: Components
2.1 Definitions of components
2.2 Integrated Circuit Fabrication
2.3 Packaging
2.3.1 Technologies of a Packages
2.3.2 Types of Packages
Chapter Three: Printed Circuit Boards and PCB Assembly
3.1 Printed Wire Boards
3.2 The Fabrication of PWBs
3.2.1 Flaws and Defects of PWBs
3.2.2 Test and Inspection of PWBs
3.3 Printed Circuit Board Assembly
3.4 Through-Hole Assembly
3.5 Surface Mount Technology Assembly
3.5.1 Stencil Printing
3.5.2 Component Placement
3.5.3 Reflow Soldering
3.5.4 Adhesives and Wave Solder
3.6 Test and Inspection of PCBA
3.6.1 Defects
3.6.2 Inspection
3.7 Design Services
3.8 Final Systems Build
3.9 Electrostatic Discharge
Chapter Four: Standards and Quality
4.1 International Standards Organization (ISO)
4.2 The Institute for Interconnecting and Packaging Electronic Circuits
(IPC)
4.3 American National Standards Institute (ANSI)
4.4 Underwriters Laboratory (UL)
4.5 The Malcolm Baldridge Award30
4.6 Bellcore
4.7 The International Electrotechnical Commission (IEC)
4.8 British Approvals Board for Telecommunications (BABT)
4.9 TUV
4.10 Canadian Safety Agency (CSA)
Chapter Five: Equipment and Companies
5.1 Semiconductors
5.2 PWB
5.3 PCB Assembly
Chapter Six: Industry Information
6.1 Overall Industry Figures
6.2 Contract Manufacturers
6.3 Emerging Regional Trends
6.4 Sources for Detailed Industry Statistics
6.4.1 Websites
6.4.2 Data for Purchase
6.5 Organizations and Their Websites
6.6 Trade Magazines and Other Periodicals
6.7 Other References
6.8 Conferences and Trade Shows
Appendix A: Acronyms
LIST OF TABLES
Table 4.1 Malcolm Baldridge Award Winners for Manufacturing
Excellence
Table 6.1 Annual Revenues Global SMT Equipment
Table 6.2 Top 50 Contract Manufacturers
(with URLs and revenues when available)
LIST OF FIGURES
Figure 2.1 Silicon Wafer
Figure 2.2 Package Technologies
Figure 2.3 Examples of Components and PCBs
Figure 3.2 A Through-Hole Printed Circuit Board
Figure 6.1 Migration of Technology
Figure 6.2 Regional Share of Contract Manufacturing Revenues,
1996
Figure 6.3 Emerging Regions for Electronics Manufacturing
Figure 6.4 Established Regions for Electronics Manufacturing
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